We provide turnkey design analysis services comprising of Signal Integrity (SI), Power Integrity (PI) and Thermal Analysis. Our engineering teams are lead by experts and they have been supporting many customers worldwide. Our Design analysis services are flexible therefore we can tailor them to exactly match your needs. We use the latest industry standard tools like Mentor Graphics, HyperLynx, Simbeor-Electromagnetic, Signal Integrity and Allegro PCB SI tool.

Signal Integrity and Power Integrity simulations

Our consultants can support you with advanced signal integrity and power integrity analysis. As clock speeds and data rates are increasing, driven by the industry needs for high-speed interfaces with multi-GHz frequencies, Signal Integrity (SI) and Power Integrity (PI) Analysis become a necessity for meeting requirements at the  PCB or system level.

Simulations consultancy is performed with leading-edge SI and PI software tools to ensure the board performance meets the requirements. Multiple tools are used to perform a wide range of analysis tasks including 3D EM full-wave extraction, network analysis, channel analysis, AC power analysis and DC power analysis.

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We provide this service at any stage of your design process. Either at the start of your PCB design to drive the placement and layout, or during layout to validate the design before going to manufacturing. When you  have a finalized PCB design that shows unsuspected behavior, we can offer a quick turn Signal Integrity simulation to either help pinpoint the root cause of the issue or to remove any doubt about the signal integrity of the board design.

Thermal Analysis

Including thermal analysis early in the design process has proven to be the preferred approach in delivering the best design in the shortest amount of time. But it can be applied at any design stage to gain the insight required to find hotspots and potential overheating. The information from the thermal analysis services we provide can be used to optimize heat sink and enclosure designs.

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SI and PI simulations Fact sheet

Design Expertise

  • Feasibility Study
  • Stack up Design
  • Conn/Cable Selection
  • Root Cause Analysis on Existing Design
  • Pre/Post Layout Simulations
  • Topology Exploration for Parallel Interfaces
  • Frequency and Time Domain Analysis
  • TDR Analysis and IBIS/AMI Simulation
  • Multi-Board Simulations
  • Model Extraction, S-parameter & RLC Parasitic Extraction
  • BER, ISI, Jitter, Loss(IL,RL) Analysis, Bath-tub Plots,.
  • High Speed Serial / Parallel Interface Analysis
  • Trace, Via, Connector, End-to-End Channel Modeling Using EM Solver
  • Crosstalk & S-parameter Modeling of Traces & Interconnects

Technology Expertise

Ethernet

  • Ethernet Over Backplane:
    IEEE P802.3ap 10 GBps, IEEE
  • P802.3ba 40 GBps and 100 GBps
  • Ethernet Over Backplane (10GBASE-KR), Gearbox
  • Ethernet Over Backplane:
    IEEE P802.3bj 25gbps/lane
    (100GBASE-KP4 PAM4 & KR4-NRZ-PAM2)
  • Chip to Module SFI:
    SFP ( INF-8074i), SFP+ (SFF-8431)
  • QSFP+ (SFF-8679), CFP/CFP2, XAUI/RXAUI/QSGMII

Storage

  • SFF-8087/88 (MiniSAS int./ext.),
    SFF-8643/44 miniSAS
  • HD Internal / External
  • SFF-8639/8680 (NVMe/SAS drives)
  • USB, SATA, SAS3, NVMe, HDD/SSD, SAS expanders
  • PCIe Switches / Controllers, PCIe add-on Cards

CPU / Memory

  • QPI/UPI, PCIE, DMI, QSGMII, SGMII
  • DDR4/3/2, RLDRAM, QDR , LPDDR
  • PCI Express, PCI Express 2.0, PCI Express 3.0
  • USB 2.0, USB 3.0

Multi-Board Simulations

  • Power card
  • Mother Board + Add-on cards
  • Line Cards, Backplanes

PDN DC Simulations

  • DC IR drop
  • Voltage Distribution
  • Temperature Rise

PDN AC Simulations

  • PDN Impedance / Resonances VRM+PCB+IC
  • Transient Noise Simulations
  • Voltage Droops, AC Voltage Noise , Di/Dt

Time Domain Noise Analysis

  • Resonance Studies
  • SSO/SSN Studies
  • Di/Dt Studies

Software Supported

  • Simbeor-Electromagnetic Signal Integrity Software
  • Mentor Graphics HyperLynx SI GHz
  • Mentor Graphics HyperLynx Thermal
  • Allegro PCB SI tool

Thermal simulations Fact sheet

Design Expertise

  • Board Level Analysis
  • Multi-Board / System Level Analysis
  • Heat Sink & Cooling Proposals
  • Component Junction & Case Temperature Computations
  • Thermal Profiles Generation for Components & PCB

Technology Expertise

  • Steady state analysis
  • Transient analysis
  • Compressible and In-compressible flows
  • Transient and steady state flow
  • Laminar & turbulent flows
  • Conjugate heat transfer
  • Fluid Structure Interaction
  • Multi phase flow
  • Heat transfer
  • Design change recommendations
  • Optimizations

Software Supported

  • Flowtherm
  • IcePAK